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Sr. Maintenance engineer Wafer Bonding

Posted Jun 7, 2022
Project ID: PHILJP00025100.1
40 hrs/week
11 months
Starts: Jun 20, 2022
Ends: May 31, 2023
Payrate range
3500 - 4900 €/month

Sr. Maintenance engineer Wafer Bonding

This Sr Maintenance engineer vacancy is to a.o. coordinate and participate in the above mentioned daily maintenance activities. This vacancy furthermore is to facilitate further growth of the MEMS foundry in particular with customer projects and product that rely on the the so-called bonding core competence capability. Bonding is a main growth focus area for the MEMS foundry with customers like Sensibel and Zephyrus."

In this role, you have the opportunity to
Live your passion for technology and keep expensive and high-tech semicon process equipment in optimum condition in order to deliver MEMS and Thin Film components to our customers.

You are responsible for
Works with hightech equipment in the semiconductor / MEMS area, in particular: Wafer Bonding and Litho/Wet Etch.
Feels and takes responsibility for the equipment availability (EA) and creates plans for the continuous improvement of the equipment availability.

Leaderships skills:
Manages the daily/weekly planned and unplanned maintenance of the Bonding cluster.
Coaches the Bonding Maintenance Engineering (ME) team in the daily work.
Acts as project leader in EA improvement projects and in CAPEX projects in the Litho / Wet Etch / Bonding clusters and (ad hoc) in the Metrology cluster.
Joins Kaizen improvement teams as a competence owner or as project lead.
Joins crash teams for complicated machine/process failures or leads these teams.
Ad hoc replaces the Litho / Wet Etch / Bonding (Process Engineering and ME) technology cluster leads
Acts as technology discussion partner for Process Engineering and Process Development
Creates / improves maintenance plans and procedures.
Evaluates finished maintenance actions.
Acts proactively on possible malfunction of equipment. Participates in Corrective and Preventive Maintenance activities
Stays in close contact with equipment owners and operations technicians before, during and after maintenance for an optimally planned and executed maintenance.
Works in a safe way for him/herself, the equipment and the environment.
Works according to environmental and quality regulations.

You are a part of
You will be part of the Equipment Engineering & Maintenance Engineering department of the MEMS foundry of Philips Engineering Solutions. As senior Maintenance Engineer / Equipment Engineer, you report to the Manager Equipment Engineering & Maintenance of the MEMS foundry. You will be part of a very experienced team that is responsible for the availability and uptime of the process equipment that is used in the development and production processes of MEMS. The assignment is in the Wafer Bonding technology cluster with strong involvement in (in particular) the Lithography and Wet Etch clusters.

To succeed in this role, you should have the following skills and experience

  • A BSc or MSc in a technical discipline relevant to the industry (electronics, mechatronics, industrial automation, physics, mechanics).
  • At least 3 years of experience as Maintenance Engineer in a production environment.
  • Experience in Semicon is highly preferred
  • Experience in Litho / Wet Etch / Bonding technology is highly preferred
  • No 9-5 mentality - willingness to work in evenings or the weekend in case of emergency.
  • Good social skills.
  • Eager to learn the technical details of all equipment and related processes.
  • Well skilled to read electrical, mechanical and pneumatic schematics.
  • Good knowledge of computers, control systems, high precision mechatronics, electronics, statisical engineering, quality engineering, PLC's and networks.
  • Willing to take equipment/process training to improve job effectiveness.
  • Willing to work in a clean-room environment.

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